ePoP (embedded package-on-package) has been developed by Samsung, and is currently in mass production. According to Digit, it's a new type of memory originally designed for wearables. Using “dynamic random-access memory (DRAM) and NAND flash in one chip that could be stacked above an application processor, resulting in 40 percent less space utilization, allowing slimmer handset designs”. Specifically, the chip fuses 3GB of RAM with 32GB of storage, giving a transfer rate of 186Mbps, with a 64-bit bandwidth (NDTV Gadgets). Utilizing the conventional 225 square millimeters of space but only 1.4mm thin, the ePoP module leaves enough room inside the smartphone for an extra battery or other component of choice. Case in point- that extra 40 percent could be used for a larger battery, all while maintaining the sleekness of current smartphones.
Samsung Develops New Space Saving Module, ePoP
ePoP (embedded package-on-package) has been developed by Samsung, and is currently in mass production. According to Digit, it's a new type of memory originally designed for wearables. Using “dynamic random-access memory (DRAM) and NAND flash in one chip that could be stacked above an application processor, resulting in 40 percent less space utilization, allowing slimmer handset designs”. Specifically, the chip fuses 3GB of RAM with 32GB of storage, giving a transfer rate of 186Mbps, with a 64-bit bandwidth (NDTV Gadgets). Utilizing the conventional 225 square millimeters of space but only 1.4mm thin, the ePoP module leaves enough room inside the smartphone for an extra battery or other component of choice. Case in point- that extra 40 percent could be used for a larger battery, all while maintaining the sleekness of current smartphones.
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